OLED microdisplays have so far been developed predominantly on 200mm wafers. The conventional CMOS technologies and backplane design limit the number and size of pixels until now. Fraunhofer FEP realized OLED microdisplays in a 28-nm backplane technology on 300mm wafers. Components with a display diagonal of 0.18” and pixel sizes of only 2.5 µm have been manufactured. This corresponds to a pixel density of 10,000 dpi – an as-yet unattained level in the global OLED microdisplay market.