SID 2024Products & Services microMIRA™


3D-Micromac AG

The microMIRA LLO system provides a highly uniform, force-free lift-off of different layers on wafers at high processing speed. The laser system can be used especially for GaN lift-off from glass and sapphire substrates in MicroLED display and semiconductor manufacturing.
Further reading

microMIRA™ - High Throughput Laser Lift-Off for microLED Application

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